Global Semiconductor & IC Packaging Materials Market Analysis, Trends, and Forecasts 2019-2025

Monday, 07. October 2019 10:24

Dublin, Oct. 07, 2019 (GLOBE NEWSWIRE) -- The "Semiconductor & IC Packaging Materials - Market Analysis, Trends, and Forecasts" report has been added to ResearchAndMarkets.com's offering.

Semiconductor and IC Packaging Materials market worldwide is projected to grow by US$9.5 Billion, driven by a compounded growth of 4.7%.

Organic Substrates, one of the segments analyzed and sized in this study, displays the potential to grow at over 5.6%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$11 Billion by the year 2025, Organic Substrates will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 5.6% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$471.4 Million to the region's size and clout in the next 5 to 6 years. Over US$1.8 Billion worth of projected demand in the region will come from other emerging Eastern European markets.

In Japan, Organic Substrates will reach a market size of US$1.1 Billion by the close of the analysis period. As the world's second largest economy and the new game changer in global markets, China exhibits the potential to grow at 4.3% over the next couple of years and add approximately US$1.6 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific, Latin America and the Middle East. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include the following, among others:

  • BASF SE (Germany)
  • Henkel AG & Co. KGaA (Germany)
  • Hitachi Chemical Co., Ltd. (Japan)
  • LG Chem Ltd. (Korea)
  • Mitsui High-Tec Inc. (Japan)
  • Sumitomo Chemical Co., Ltd. (Japan)
  • Tanaka Holdings Co., Ltd. (Japan)
  • Toray Industries, Inc. (Japan)

Key Topics Covered:

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • Semiconductor & IC Packaging Materials Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Global Competitor Market Shares by Segment
  • Organic Substrates (Types) Global Competitor Market Share Positioning for 2019 & 2025
  • Bonding Wires (Types) Market Share Breakdown of Key Players: 2019 & 2025
  • Lead frames (Types) Competitor Revenue Share (in %): 2019 & 2025
  • Ceramic Packages (Types) Market Share Shift by Company: 2019 & 2025
  • Encapsulation Resins (Types) Global Competitor Market Share Positioning for 2019 & 2025

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

  • Market Facts & Figures
  • US Semiconductor & IC Packaging Materials Market Share (in %) by Company: 2019 & 2025
  • Organic Substrates (Types) Market Share Analysis (in %) of Leading Players in the US for 2019 & 2025
  • Bonding Wires (Types) Competitor Revenue Share (in %) in the US: 2019 & 2025
  • Lead frames (Types) Market Share Breakdown (in %) of Major Players in the US: 2019 & 2025
  • Ceramic Packages (Types) Market in the US: Percentage Breakdown of Revenues by Company for 2019 & 2025
  • Encapsulation Resins (Types) Competitor Market Share Breakdown (in %) in the US for 2019 & 2025

CANADA

JAPAN

CHINA

EUROPE

  • Market Facts & Figures
  • European Semiconductor & IC Packaging Materials Market: Competitor Market Share Scenario (in %) for 2019 & 2025
  • Organic Substrates (Types) Market Share (in %) by Company in Europe: 2019 & 2025
  • Bonding Wires (Types) Market Share (in %) of Major Players in Europe: 2019 & 2025
  • Lead frames (Types) Competitor Market Share Analysis (in %) in Europe: 2019 & 2025
  • Ceramic Packages (Types) Market in Europe: Competitor Revenue Share Shift (in %) for 2019 & 2025
  • Encapsulation Resins (Types) Competitor Market Share (in %) Positioning in Europe for 2019 & 2025

FRANCE

GERMANY

ITALY

UNITED KINGDOM

REST OF EUROPE

ASIA-PACIFIC

REST OF WORLD

IV. COMPETITION

V. CURATED RESEARCH

For more information about this report visit https://www.researchandmarkets.com/r/45zqh

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